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LMZ31520RLGT Fiches technique(PDF) 6 Page - Texas Instruments

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No de pièce LMZ31520RLGT
Description  20A SIMPLE SWITCHER짰 Power Module with 3.0V-14.5V Input in QFN Package
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

LMZ31520RLGT Fiches technique(HTML) 6 Page - Texas Instruments

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LMZ31520
SLVSBM9B – OCTOBER 2013 – REVISED DECEMBER 2013
www.ti.com
PIN DESCRIPTIONS
TERMINAL
DESCRIPTION
NAME
NO.
This pin is connected internally to the power ground of the device. This pin should only be used as the zero
AGND
9
volt ground reference for connecting the voltage setting resistor (RSET). Do not connect AGND to PGND.
See Layout Recommendations.
4
8
12
Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. These
DNC
20
pins are connected to internal circuitry. Each pin must be soldered to an isolated pad.
21
35
36
Frequency Select pin. Leave this pin open (floating) to select 500 kHz (typ) operating frequency. Connect
FREQ_SEL
7
this pin to V5V pin to select 850 kHz (typ) operating frequency. Connect a 66 k
Ω resistor between this pin
and PGND to select 300 kHz (typ) operating frequency. See Table 2 for more info.
Current limit setting pin. Connecting a resistor between this pin and PGND sets the current limit. When left
ILIM
6
open, refer to the Electrical Characterization table for current limit value.
INH
16
Inhibit pin. Use an open drain or open collector logic device to ground this pin to control the INH function.
29
30
Not Connected. These pins are internally isolated from any signal and all other pins. Each pin must be
NC
31
soldered to a pad on the PCB. These pins can be left isolated, connected to one another, or connected to
any signal on the PCB.
32
45
1
5
17
33
34
37
38
39
40
41
This is the return current path for the power stage of the device. Connect these pins to the load and to the
46
bypass capacitors associated with VIN and VOUT. Pads 65, 67, 70, and 72 should be connected to PCB
PGND
47
ground planes using multiple vias for good thermal performance. Not all pins are connected together
internally. All pins must be connected together externally with a copper plane or pour directly under the
48
device.
49
50
51
62
63
64
65
67
70
72
6
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMZ31520


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