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TDC7201 Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TDC7201
Description  TDC7201 Time-to-Digital Converter for Time-of-Flight Applications in LIDAR, Range Finders, and ADAS
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

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TDC7201
www.ti.com
SNAS686 – MAY 2016
Product Folder Links: TDC7201
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Copyright © 2016, Texas Instruments Incorporated
Recommended Operating Conditions (continued)
At TA = 25°C , VDD1 = VDD2 = 3.3 V, GND1 = GND2 = 0 V (unless otherwise noted).
MIN
NOM
MAX
UNIT
(4)
TDC7201 device in combined measurement mode where START1 and START2 are connected together:
(a) A common REFERENCE_START signal is applied to START1 and START2 at least 12 ns before occurrence of actual START and
STOP signals in Mode 1 (and at least 2 × tCLOCK before occurrence of actual Start and Stop signals in Mode 2).
(b) Start signal is connected to STOP1
(c) Stop signal is connected to STOP2
(d) Two time periods T1 (REFERENCE_START to Start) and T2 (REFERENCE_START to Stop) are measured and their difference (T2-
T1) is the time between Start to Stop
TIMING REQUIREMENTS: ENABLE INPUT
TREN
Rise time for enable signal (20% to 80%)
1 to 100
ns
TFEN
Fall time for enable signal (20% to 80%)
1 to 100
ns
TIMING REQUIREMENTS: START1, STOP1, CLOCK, START2, STOP2
TRST, TFST
Maximum rise, fall time for START, STOP signals
(20% to 80%)
1
ns
TRXCLK, TFXCLK
Maximum rise, fall time for external CLOCK
(20% to 80%)
1
ns
TIMING REQUIREMENTS: TRIGG1, TRIGG2
TTRIG1START1
Time from TRIG1 to START1
5
ns
TTRIG2START2
Time from TRIG2 to START2
5
ns
TIMING REQUIREMENTS: Measurement Mode 1 Combined Operation(4)
T1STARTSTOP_Comb_Min
Minimum time between START and STOP signal
combined
0.25
ns
TEMPERATURE
TA
Ambient temperature
–40
85
°C
TJ
Junction temperature
–40
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
TDC7201
UNIT
ZAX (nFBGA)
25 PINS
RθJA
Junction-to-ambient thermal resistance
155.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
109.5
°C/W
RθJB
Junction-to-board thermal resistance
114.1
°C/W
ψJT
Junction-to-top characterization parameter
20.8
°C/W
ψJB
Junction-to-board characterization parameter
110.6
°C/W


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