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TCA9555RTWR Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TCA9555RTWR
Description  Low-Voltage 16-Bit I2C and SMBus I/O Expander with Interrupt Output and Configuration Registers
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TCA9555RTWR Fiches technique(HTML) 5 Page - Texas Instruments

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TCA9555
www.ti.com
SCPS200D – JULY 2009 – REVISED JULY 2016
Product Folder Links: TCA9555
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
6
V
VI
Input voltage(2)
–0.5
6
V
VO
Output voltage(2)
–0.5
6
V
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–20
mA
IIOK
Input-output clamp current
VO < 0 or VO > VCC
±20
mA
IOL
Continuous output low current
VO = 0 to VCC
50
mA
IOH
Continuous output high current
VO = 0 to VCC
–50
mA
ICC
Continuous current through GND
–250
mA
Continuous current through VCC
160
Tj(MAX)
Maximum junction temperature
100
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
(1)
For voltages applied above VCC, an increase in ICC results.
(2)
The values shown apply to specific junction temperatures, which depend on the RθJA of the package used. See the Calculating Junction
Temperature and Power Dissipation section on how to calculate the junction temperature.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
Supply voltage
1.65
5.5
V
VIH
High-level input voltage
SCL, SDA
0.7 × VCC
VCC
(1)
V
A2–A0, P07–P00, P17–P10
0.7 × VCC
5.5
VIL
Low-level input voltage
SCL, SDA
–0.5 0.3 × VCC
V
A2–A0, P07–P00, P17–P10
–0.5 0.3 × VCC
IOH
High-level output current
P07–P00, P17–P10
–10
mA
IOL
Low-level output current(2)
P07–P00, P17–P10
Tj ≤ 65°C
25
mA
Tj ≤ 85°C
18
Tj ≤ 100°C
11
IOL
Low-level output current(2)
INT, SDA
Tj ≤ 85°C
6
mA
Tj ≤ 100°C
3.5
TA
Operating free-air temperature
–40
85
°C


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