TCA9539RGER datasheet(5/46 Pages) TI1

No de pièce	TCA9539RGER

Description	Low Voltage 16-Bit I2C and SMBus Low-Power I/O Expander with Interrupt Output, Reset Pin, and Configuration Registers

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Fabricant	TI1 [Texas Instruments]

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TCA9539

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SCPS202C – OCTOBER 2009 – REVISED MAY 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

6

V

VI

Input voltage(2)

–0.5

6

V

VO

Output voltage (2)

–0.5

6

V

IIK

Input clamp current

VI < 0

–20

mA

IOK

Output clamp current

VO < 0

–20

mA

IIOK

Input-output clamp current

VO < 0 or VO > VCC

±20

mA

IOL

Continuous output low current

VO = 0 to VCC

50

mA

IOH

Continuous output high current

VO = 0 to VCC

–50

mA

ICC

Continuous current through GND

–250

mA

Continuous current through VCC

160

Tj(MAX)

Maximum junction temperature

100

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

(2)

±1000

(1)

For voltages applied above VCC, an increase in ICC will result.

(2)

The values shown apply to specific junction temperatures, which depend on the RθJA of the package used. See the Calculating Junction

Temperature and Power Dissipation section on how to calculate the junction temperature.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

1.65

5.5

V

VIH

High-level input voltage

SCL, SDA

0.7 × VCC

VCC (1)

V

A0, A1, RESET, P07–P00, P10–P17

0.7 × VCC

5.5

VIL

Low-level input voltage

SCL, SDA, A0, A1, RESET, P07–P00, P10–P17

–0.5 0.3 × VCC

V

IOH

High-level output current

P07–P00, P17–P10

–10

mA

IOL

Low-level output current(2)

P00–P07, P10–P17

Tj ≤ 65°C

25

mA

Tj ≤ 85°C

18

Tj ≤ 100°C

11

IOL

Low-level output current(2)

INT, SDA

Tj ≤ 85°C

6

mA

Tj ≤ 100°C

3.5

TA

Operating free-air temperature

–40

85

°C

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