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STQ-3016 Fiches technique(PDF) 6 Page - Stanford Microdevices |
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STQ-3016 Fiches technique(HTML) 6 Page - Stanford Microdevices |
6 / 8 page The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved. 522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com 6 05/07/01 rev 2.0 Advanced Data Sheet 674 'LUHFW 4XDGUDWXUH0RGXODWRU Part Number Ordering Information Part Number Reel Size Devices/Reel STQ-3016 TBD TBD Caution: ESD Sensitive Appropriate precaution in handling, packaging and testing devices must be observed. Part Symbolization The part will be symbolized with a “TBD” marking designator on the top surface of the package. Package Dimensions Test PCB Pad Layout 12°(4X) NOTE 1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE SPECIFIED 3. COPLANARITY : 0.1 mm 4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 5. FOLLOWED FROM JEDEC MO-153 0.030 0.024 0.60 0.75 0.45 L 0.018 0° −−− y θ 0° −−− 8° 0.10 −−− −−− −−− −−− 8° 0.004 MIN −−− 0.000 0.031 −−− 0.193 0.004 −−− 0.169 0.007 DIMENSIONS IN MILLIMETERS 0.00 A1 D E1 e E b C A2 4.90 −−− 4.30 −−− 0.80 0.09 0.19 SYMBOLS A −−− MIN −−− 0.10 1.05 5.10 −−− 0.20 4.50 −−− 0.30 5.00 4.40 0.65 6.40 −−− −−− 1.00 MAX 1.15 −−− NOM 0.004 −−− 0.197 0.173 0.026 0.252 0.039 −−− −−− 0.201 −−− 0.177 −−− 0.041 0.008 0.012 DIMENSIONS IN INCHES NOM −−− 0.045 MAX θ D1 2.80 0.110 −−− −−− −−− −−− E2 2.80 0.110 −−− −−− −−− −−− 3.0 3.0 1.25 6.9 0.7 0.9 φ0.25 via - Indicates metalization - vias connect pad to underlying ground plane all units are in mm 0.62 0.62 0.30 0.35 |
Numéro de pièce similaire - STQ-3016 |
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Description similaire - STQ-3016 |
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