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SN74AUP1G08DCKTE4 Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce SN74AUP1G08DCKTE4
Description  Low-Power Single 2-Input Positive-AND Gate
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AUP1G08DCKTE4 Fiches technique(HTML) 2 Page - Texas Instruments

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SN74AUP1G08
SCES502P – NOVEMBER 2003 – REVISED JUNE 2016
www.ti.com
Product Folder Links: SN74AUP1G08
Submit Documentation Feedback
Copyright © 2003–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 4
6
Specifications......................................................... 5
6.1
Absolute Maximum Ratings ...................................... 5
6.2
ESD Ratings.............................................................. 5
6.3
Recommended Operating Conditions ...................... 5
6.4
Thermal Information .................................................. 6
6.5
Electrical Characteristics........................................... 7
6.6
Switching Characteristics, CL = 5 pF ........................ 7
6.7
Switching Characteristics, CL = 10 pF ...................... 8
6.8
Switching Characteristics, CL = 15 pF ...................... 8
6.9
Switching Characteristics, CL = 30 pF ...................... 8
6.10
Operating Characteristics........................................ 8
6.11
Typical Characteristics ............................................ 9
7
Parameter Measurement Information ................ 10
7.1
Propagation Delays, Setup and Hold Times, and
Pulse Duration ......................................................... 10
7.2
Enable and Disable Times ..................................... 11
8
Detailed Description ............................................ 12
8.1
Overview ................................................................. 12
8.2
Functional Block Diagram ....................................... 12
8.3
Feature Description................................................. 12
8.4
Device Functional Modes........................................ 12
9
Application and Implementation ........................ 13
9.1
Application Information............................................ 13
9.2
Typical Application ................................................. 13
10
Power Supply Recommendations ..................... 14
11
Layout................................................................... 14
11.1
Layout Guidelines ................................................. 14
11.2
Layout Example .................................................... 14
12
Device and Documentation Support ................. 15
12.1
Receiving Notification of Documentation Updates 15
12.2
Community Resources.......................................... 15
12.3
Trademarks ........................................................... 15
12.4
Electrostatic Discharge Caution ............................ 15
12.5
Glossary ................................................................ 15
13
Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision O (June 2014) to Revision P
Page
Updated Applications and Device Information table............................................................................................................... 1
Updated pinout images and Pin Functions table.................................................................................................................... 4
Added temperature ranges for Storage temperature, Tstg and Junction temperature, TJ in Absolute Maximum Ratings...... 5
Changed Handling Ratings to ESD Ratings and changed MIN, MAX column to a VALUE column ...................................... 5
Added Receiving Notification of Documentation Updates section ....................................................................................... 15
Changes from Revision N (November 2012) to Revision O
Page
Updated document to new TI data sheet format. ................................................................................................................... 1
Removed ordering information. .............................................................................................................................................. 1
Added Applications. ................................................................................................................................................................ 1
Fixed typo in YFP package drawing. ..................................................................................................................................... 4
Added Handling Ratings table ................................................................................................................................................ 5
Added Thermal Information table. .......................................................................................................................................... 6
Added Typical Characteristics. ............................................................................................................................................... 9
Changes from Revision M (September 2012) to Revision N
Page
Changed DPW package pinout .............................................................................................................................................. 4


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