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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SN74AUP1G34 Fiches technique(PDF) 4 Page - Texas Instruments |
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SN74AUP1G34 Fiches technique(HTML) 4 Page - Texas Instruments |
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4 / 33 page  SN74AUP1G34 SCES603K – AUGUST 2004 – REVISED OCTOBER 2014 www.ti.com 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 0 2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification 0 1000 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) MIN MAX UNIT VCC Supply voltage 0.8 3.6 V VCC = 0.8 V VCC VCC = 1.1 V to 1.95 V 0.65 × VCC VIH High-level input voltage V VCC = 2.3 V to 2.7 V 1.6 VCC = 3 V to 3.6 V 2 VCC = 0.8 V 0 VCC = 1.1 V to 1.95 V 0.35 × VCC VIL Low-level input voltage V VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.9 VI Input voltage 0 3.6 V VO Output voltage 0 VCC V VCC = 0.8 V –20 µA VCC = 1.1 V –1.1 VCC = 1.4 V –1.7 IOH (2) High-level output current VCC = 1.65 V –1.9 mA VCC = 2.3 V –3.1 VCC = 3 V -4 VCC = 0.8 V 20 µA VCC = 1.1 V 1.1 VCC = 1.4 V 1.7 IOL (2) Low-level output current VCC = 1.65 V 1.9 mA VCC = 2.3 V 3.1 VCC = 3 V 4 Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V TA Operating free-air temperature –40 85 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. (2) Defined by the signal integrity requirements and design goal priorities 7.4 Thermal Information DBV DCK DRL DSF DRY THERMAL METRIC(1) UNIT 5 PINS 5 PINS 5 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 271.4 338.4 349.7 407.1 554.9 RθJC(top) Junction-to-case (top) thermal resistance 213.5 110.6 120.5 232.0 385.4 RθJB Junction-to-board thermal resistance 108.2 118.8 171.4 306.9 388.2 °C/W ψJT Junction-to-top characterization parameter 89.3 3.0 10.8 40.3 159.0 ψJB Junction-to-board characterization parameter 107.6 117.8 169.4 306.0 384.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: SN74AUP1G34 |
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