Moteur de recherche de fiches techniques de composants électroniques |
|
LM2594HVMX-5.0 Fiches technique(PDF) 4 Page - Texas Instruments |
|
LM2594HVMX-5.0 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 41 page 4 LM2594, LM2594HV SNVS118D – DECEMBER 1999 – REVISED MAY 2016 www.ti.com Product Folder Links: LM2594 LM2594HV Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Supply voltage LM2594 45 V LM2594HV 60 ON/OFF pin input voltage −0.3 25 V Feedback pin voltage −0.3 25 V Output voltage to ground (steady state) −1 V Power dissipation Internally limited Lead temperature D8 package Vapor phase (60 s) 215 °C Infrared (15 s) 220 P package (soldering, 10 s) 260 Maximum junction temperature 150 °C Storage temperature, Tstg −65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human-body model is a 100-pF capacitor discharged through a 1.5k resistor into each pin. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage LM2594 4.5 40 V LM2594HV 4.5 60 V Temperature −40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance to JESD 51-7. (3) Thermal resistances were simulated on a 4 -layer, JEDEC board. 7.4 Thermal Information THERMAL METRIC(1) LM2594, LM2594HV UNIT D (SOIC) P (PDIP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance(2)(3) 150 95 °C/W |
Numéro de pièce similaire - LM2594HVMX-5.0 |
|
Description similaire - LM2594HVMX-5.0 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |