 |
Moteur de recherche de fiches techniques de composants électroniques |
|
|
Moteur de recherche de fiches techniques de composants électroniques |
|
CSD18531Q5A Fiches technique(PDF) 3 Page - Texas Instruments |
|
|
||||||||||||||||||||||||||||||
CSD18531Q5A Fiches technique(HTML) 3 Page - Texas Instruments |
|
|
3 / 13 page  CSD18531Q5A www.ti.com SLPS321E – JUNE 2012 – REVISED AUGUST 2015 5 Specifications 5.1 Electrical Characteristics (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA 60 V IDSS Drain-to-source leakage current VGS = 0 V, VDS = 48 V 1 μA IGSS Gate-to-source leakage current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA 1.5 1.8 2.3 V VGS = 4.5 V, ID = 22 A 4.4 5.8 m Ω RDS(on) Drain-to-source on-resistance VGS = 10 V, ID = 22 A 3.5 4.6 m Ω gfs Transconductance VDS = 30 V, ID = 22 A 128 S DYNAMIC CHARACTERISTICS Ciss Input capacitance 3200 3840 pF Coss Output capacitance VGS = 0 V, VDS = 30 V, ƒ = 1 MHz 380 456 pF Crss Reverse transfer capacitance 11 14 pF RG Series gate resistance 1.2 2.4 Ω Qg Gate charge total (4.5 V) 18 22 nC Qg Gate charge total (10 V) 36 43 Qgd Gate charge gate-to-drain VDS = 30 V, ID = 22 A 5.9 nC Qgs Gate charge gate-to-source 6.9 nC Qg(th) Gate charge at Vth 5.2 nC Qoss Output charge VDS = 30 V, VGS = 0 V 32 nC td(on) Turn on delay time 4.4 ns tr Rise time 7.8 ns VDS = 30 V, VGS = 10 V, IDS = 22 A, RG = 0 Ω td(off) Turn off delay time 20 ns tf Fall time 2.7 ns DIODE CHARACTERISTICS VSD Diode forward voltage ISD = 22 A, VGS = 0 V 0.8 1 V Qrr Reverse recovery charge 100 nC VDS= 30 V, IF = 22 A, di/dt = 300 A/ μs trr Reverse recovery time 40 ns 5.2 Thermal Information (TA = 25°C unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT RθJC Junction-to-case thermal resistance(1) 1.0 °C/W RθJA Junction-to-ambient thermal resistance(1)(2) 50 °C/W (1) RθJC is determined with the device mounted on a 1 inch 2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CSD18531Q5A |
Numéro de pièce similaire - CSD18531Q5A |
|
Description similaire - CSD18531Q5A |
|
|
|
Lien URL |
| Politique de confidentialité |
| ALLDATASHEET.FR |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
French ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
