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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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CSD17570Q5B Fiches technique(PDF) 3 Page - Texas Instruments |
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CSD17570Q5B Fiches technique(HTML) 3 Page - Texas Instruments |
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3 / 13 page  CSD17570Q5B www.ti.com SLPS471C – FEBRUARY 2014 – REVISED FEBRUARY 2015 5 Specifications 5.1 Electrical Characteristics (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-Source Voltage VGS = 0 V, ID = 250 μA 30 V IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 24 V 1 μA IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, ID = 250 μA 1.1 1.5 1.9 V VGS = 4.5 V, ID = 50 A 0.74 0.92 m Ω RDS(on) Drain-to-Source On-Resistance VGS = 10 V, ID = 50 A 0.56 0.69 m Ω gƒs Transconductance VDS = 15 V, ID = 50 A 271 S DYNAMIC CHARACTERISTICS Ciss Input Capacitance 10400 13600 pF Coss Output Capacitance VGS = 0 V, VDS = 15 V, ƒ = 1 MHz 1450 1890 pF Crss Reverse Transfer Capacitance 877 1140 pF RG Series Gate Resistance 1.8 3.6 Ω Qg Gate Charge Total (4.5 V) 93 121 nC Qgd Gate Charge Gate-to-Drain 34 nC VDS = 15 V, ID = 50 A Qgs Gate Charge Gate-to-Source 27 nC Qg(th) Gate Charge at Vth 17 nC Qoss Output Charge VDS = 15 V, VGS = 0 V 40 nC td(on) Turn On Delay Time 5 ns tr Rise Time 36 ns VDS = 15 V, VGS = 10 V, IDS = 50 A, RG = 0 Ω td(off) Turn Off Delay Time 144 ns tƒ Fall Time 74 ns DIODE CHARACTERISTICS VSD Diode Forward Voltage ISD = 50 A, VGS = 0 V 0.8 1 V Qrr Reverse Recovery Charge 34 nC VDS= 15 V, IF = 50 A, di/dt = 300 A/ μs trr Reverse Recovery Time 51 ns 5.2 Thermal Information (TA = 25°C unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT RθJC Junction-to-Case Thermal Resistance(1) 0.8 °C/W RθJA Junction-to-Ambient Thermal Resistance(1)(2) 50 (1) RθJC is determined with the device mounted on a 1 inch 2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CSD17570Q5B |
Numéro de pièce similaire - CSD17570Q5B_16 |
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Description similaire - CSD17570Q5B_16 |
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