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DAC70004 Fiches technique(PDF) 4 Page - Texas Instruments |
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DAC70004 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 38 page 4 DAC80004, DAC70004, DAC60004 SLASED6B – APRIL 2016 – REVISED JUNE 2016 www.ti.com Product Folder Links: DAC80004 DAC70004 DAC60004 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage, VDD to GND –0.3 7 V Voltage, digital input or output to GND –0.3 VDD + 0.3 V Voltage, analog input (REFIN) or output (VOUTx) to GND –0.3 VDD + 0.3 V Input current to any pin except supply pins –10 10 mA Maximum junction temperature 150 °C Storage temperature range, Tstg -60 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Voltage, VDD to GND 2.7 5.5 V Voltage, analog input (REFIN) or output (VOUTx) to GND 2.7 V ≤ VDD ≤ 4.5 V 2.2 VDD – 0.2 V 4.5 V ≤ VDD ≤ 5.5 V 2.2 VDD V Ambient Operating Temperature, TA -40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) DACx0004 UNIT DMD (VSON) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 39.6 99.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 27.3 23.4 °C/W RθJB Junction-to-board thermal resistance 9.0 42.8 °C/W ψJT Junction-to-top characterization parameter 0.3 0.9 °C/W ψJB Junction-to-board characterization parameter 8.9 42.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.5 N/A °C/W |
Numéro de pièce similaire - DAC70004 |
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Description similaire - DAC70004 |
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