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ADC121S021 Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce ADC121S021
Description  Single-Channel, 50- to 200-ksps, 12-Bit A/D Converter
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

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4
ADC121S021
SNAS305J – JULY 2005 – REVISED MARCH 2016
www.ti.com
Product Folder Links: ADC121S021
Submit Documentation Feedback
Copyright © 2005–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(4)
When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin must be limited to
10 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The absolute maximum rating specification does not apply to the VA pin. The current into the VA pin is
limited by the Analog Supply Voltage specification.
(5)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula
PDmax = (TJmax – TA) / RθJA. The values for maximum power dissipation listed above is reached only when the device is operated in a
severe fault condition (for example, when input or output pins are driven beyond the power supply voltages, or the power supply polarity
is reversed). Obviously, such conditions must always be avoided.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Analog supply voltage, VA
–0.3
6.5
V
Voltage on any digital pin to GND
–0.3
6.5
V
Voltage on any analog pin to GND
–0.3
VA + 0.3
V
Input current at any pin(4)
±10 mA
mA
Package input current(4)
±20 mA
mA
Power consumption at TA = 25°C
See (5)
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
HBM is 100-pF capacitor discharged through a 1.5-k
Ω resistor.
(3)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(4)
Machine model is 220-pF discharged through 0
Ω.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)
±3500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(3)
±1250
Machine mode (MM)(4)
±300
(1)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(2)
Regardless of supply voltage
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Operating temperature, TA
–40
85
°C
Supply voltage, VA
2.7
5.25
V
Digital input pins voltage(2)
–0.3
5.25
V
Analog input pins voltage
0
VA
V
Clock frequency
0.025
20
MHz
Sample rate
1
Msps


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