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ADC121S021 Fiches technique(PDF) 4 Page - Texas Instruments |
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ADC121S021 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 26 page 4 ADC121S021 SNAS305J – JULY 2005 – REVISED MARCH 2016 www.ti.com Product Folder Links: ADC121S021 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) All voltages are measured with respect to GND = 0 V, unless otherwise specified. (4) When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin must be limited to 10 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The absolute maximum rating specification does not apply to the VA pin. The current into the VA pin is limited by the Analog Supply Voltage specification. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula PDmax = (TJmax – TA) / RθJA. The values for maximum power dissipation listed above is reached only when the device is operated in a severe fault condition (for example, when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions must always be avoided. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Analog supply voltage, VA –0.3 6.5 V Voltage on any digital pin to GND –0.3 6.5 V Voltage on any analog pin to GND –0.3 VA + 0.3 V Input current at any pin(4) ±10 mA mA Package input current(4) ±20 mA mA Power consumption at TA = 25°C See (5) Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) HBM is 100-pF capacitor discharged through a 1.5-k Ω resistor. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. (4) Machine model is 220-pF discharged through 0 Ω. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±3500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±1250 Machine mode (MM)(4) ±300 (1) All voltages are measured with respect to GND = 0 V, unless otherwise specified. (2) Regardless of supply voltage 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating temperature, TA –40 85 °C Supply voltage, VA 2.7 5.25 V Digital input pins voltage(2) –0.3 5.25 V Analog input pins voltage 0 VA V Clock frequency 0.025 20 MHz Sample rate 1 Msps |
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Description similaire - ADC121S021 |
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