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SM05 Datasheet(Fiches technique) 4 Page - Union Semiconductor, Inc.

Numéro de pièce SM05
Description  Low Capacitance Quad Line ESD Protection Diode Array
Télécharger  6 Pages
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Fabricant  UNIONSEMI [Union Semiconductor, Inc.]
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Logo UNIONSEMI - Union Semiconductor, Inc.

SM05 Datasheet(HTML) 4 Page - Union Semiconductor, Inc.

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___________________________________________________________________________ Rev.06 May.2016
Typical Operating Circuits
Detailed Description
Device Connection Options
The SM05 is designed to protect one bidirectional or two unidirectional data or I/O lines operating at
5 volts. Connection options are as follows: Bidirectional: Pin 1 is connected to the data line and pin 2
is connected to ground (Since the device is symmetrical, these connections may be reversed). The
ground connection should be made directly to a ground plane. The path length should be kept as short
as possible to minimize parasitic inductance. Pin 3 is not connected.
Unidirectional: Data lines are
connected to pin 1 and pin 2. Pin 3 is connected to ground. For best results, this pin should be
connected directly to a ground plane on the board. The path length should be kept as short as possible
to minimize parasitic inductance.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The
following guidelines are recommended (Refer to application note SI99-01 for more detailed
information): Place the TVS near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the TVS and the protected line. Minimize all conductive loops
including power and ground loops. The ESD transient return path to ground should be kept as short as
possible. Never run critical signals near board edges. Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin
finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small
compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile
will be determined by the requirements of the solder paste. Therefore, these devices are compatible
with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions,
matte tin does not have any added alloys that can cause degradation of the solder joint.

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