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DF14-2S-1.25C Fiches technique(PDF) 6 Page - Hirose Electric |
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DF14-2S-1.25C Fiches technique(HTML) 6 Page - Hirose Electric |
6 / 6 page B182 BPrecautions 1. Recommended Temperature Profile (SMT) Note 1.The soldering process is allowed up to twice under the same condition. However, the interval between the first and second processes must be maintained at the room temperature. Note 1.The temperature indicates the board surface temperature on the connector lead area. 2. Recommended Manual Soldering Condition (SMT) Manual soldering: 290ç for 2 seconds 3. Recommended Screen Thickness (SMT) 0.15 to 0.2mm 4. Board Sled (SMT) Max 0.03mm at the connector center area, based on both connector edges 5. Cleaning Condition Refer to Nylon Connector Use Hand book. 6. Connection Condition Refer to Nylon Connector Use Hand book. sBe careful to carry out the crimping operation according to the "Crimping Condition Sheet" and "Crimping Quality Reference", because the crimping contact style is too small. 7. Cautions sBe careful for an excessive scoop insertion/extraction, which will cause damage to the product. |
Numéro de pièce similaire - DF14-2S-1.25C |
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Description similaire - DF14-2S-1.25C |
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