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TLP104 Fiches technique(PDF) 8 Page - Toshiba Semiconductor

No de pièce TLP104
Description  IPM (Intelligent Power Module)
Download  13 Pages
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Fabricant  TOSHIBA [Toshiba Semiconductor]
Site Internet  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP104 Fiches technique(HTML) 8 Page - Toshiba Semiconductor

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TLP104
2015-10-16
8
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
 Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of
whether a soldering iron or a reflow soldering method is used.
1)
When Using Soldering Reflow
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
An example of a temperature profile when lead (Pb)-free solder is used
 Reflow soldering must be performed once or twice.
 The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow
 Apply preheating of 150 °C for 60 to 120 seconds.
 Mounting condition of 260 °C or less within 10 seconds is recommended.
 Flow soldering must be performed once
3) When using soldering Iron
 Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds
not exceeding 350 °C.
 Heating by soldering iron must be only once per 1 lead


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