TPS62510

SLVS651B – MAY 2006 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage at PVIN, AVIN

–0.3

4

V

–0.3

4

V

–0.3

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage on pins PVIN and AVIN

1.8

3.8

V

Output voltage

0.6

V

1500

mA

L

Inductor value

2.2

μH

10

μF

22

μF

Operating ambient temperature

-40

85

°C

Operating junction temperature

–40

125

°C

(1)

See Application and Implementation for more information.

6.4 Thermal Information

TPS62510

DRC [VSON]

UNIT

10 PINS

Junction-to-ambient thermal resistance

48.5

°C/W

Junction-to-case (top) thermal resistance

71.2

°C/W

Junction-to-board thermal resistance

23.0

°C/W

Junction-to-top characterization parameter

2.1

°C/W

Junction-to-board characterization parameter

23.1

°C/W

Junction-to-case (bottom) thermal resistance

4.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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