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TPS54428DRCR Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS54428DRCR Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 29 page PowerPAD TPS54428 SW VBST SS VFB GND 8 2 3 4 1 EN VREG5 7 6 5 VIN EN VFB VREG5 SS GND VIN VIN VBST SW SW Exposed Thermal Die PAD on Underside PGND 1 2 3 4 5 10 9 8 7 6 3 TPS54428 www.ti.com SLVSB42D – NOVEMBER 2011 – REVISED JANUARY 2016 Product Folder Links: TPS54428 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated 5 Pin Configuration and Functions DDA Package with Thermal Pad 8-Pin SO PowerPAD Top View DRC Package with Thermal Pad 10-Pin VSON Top View Pin Functions PIN DESCRIPTION NAME DDA DRC EN 1 1 Enable input control. Active high. VFB 2 2 Converter feedback input. Connect to output voltage with feedback resistor divider. VREG5 3 3 5.5 V power supply output. A capacitor (typical 1 µF) should be connected to GND. VREG5 is not active when EN is low. SS 4 4 Soft-start control. An external capacitor should be connected to GND. GND 5 Ground pin. Power ground return for switching circuit. Connect sensitive SS and VFB returns to GND at a single point. GND 5 Ground pin. Connect sensitive SS and VFB returns to GND at a single point. SW 6 6, 7 Switch node connection between high-side NFET and low-side NFET. VBST 7 8 Supply input for the high-side FET gate drive circuit. Connect 0.1µF capacitor between VBST and SW pins. An internal diode is connected between VREG5 and VBST. VIN 8 9, 10 Input voltage supply pin. Exposed Thermal Pad Back side Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be connected to GND. Exposed Thermal Pad Back side Thermal pad of the package. PGND power ground return of internal low-side FET. Must be soldered to achieve appropriate dissiapation. |
Numéro de pièce similaire - TPS54428DRCR |
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Description similaire - TPS54428DRCR |
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