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TPS657095YFFR Fiches technique(PDF) 2 Page - Texas Instruments

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No de pièce TPS657095YFFR
Description  PMU for Embedded Camera Module
Download  41 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TPS657095YFFR Fiches technique(HTML) 2 Page - Texas Instruments

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TPS657095
SLVSCW2A – SEPTEMBER 2015 – REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: TPS657095
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 5
6.6
Timing Requirements ................................................ 8
6.7
Typical Characteristics .............................................. 9
7
Detailed Description ............................................ 10
7.1
Overview ................................................................. 10
7.2
Functional Block Diagram ....................................... 10
7.3
Feature Description................................................. 11
7.4
Device Functional Modes........................................ 16
7.5
Programming........................................................... 16
7.6
Register Map........................................................... 20
8
Application and Implementation ........................ 31
8.1
Application Information............................................ 31
8.2
Typical Application .................................................. 31
9
Power Supply Recommendations ...................... 35
10
Layout................................................................... 35
10.1
Layout Guidelines ................................................. 35
10.2
Layout Example .................................................... 35
11
Device and Documentation Support ................. 36
11.1
Device Support .................................................... 36
11.2
Community Resources.......................................... 36
11.3
Trademarks ........................................................... 36
11.4
Electrostatic Discharge Caution ............................ 36
11.5
Glossary ................................................................ 36
12
Mechanical, Packaging, and Orderable
Information ........................................................... 37
12.1
Package Summary................................................ 37
12.2
Chip Scale Package Dimensions.......................... 37
4 Revision History
DATE
REVISION
NOTES
February 2016
A
Contact TI for Rev A datasheet changes


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