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54F540 Fiches technique(PDF) 4 Page - National Semiconductor (TI) |
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54F540 Fiches technique(HTML) 4 Page - National Semiconductor (TI) |
4 / 8 page DC Electrical Characteristics (Continued) Symbol Parameter 54F74F Units VCC Conditions Min Typ Max ICCH Power Supply Current (’F540) 11 20 mA Max VO e HIGH ICCL Power Supply Current (’F540) 53 75 mA Max VO e LOW ICCZ Power Supply Current (’F540) 31 45 mA Max VO e HIGH Z ICCH Power Supply Current (’F541) 26 35 mA Max VO e HIGH ICCL Power Supply Current (’F541) 55 75 mA Max VO e LOW ICCZ Power Supply Current (’F541) 31 55 mA Max VO e HIGH Z AC Electrical Characteristics 74F 54F 74F TA ea25 C TA VCC e Mil TA VCC e Com Symbol Parameter VCC ea50V CL e 50 pF CL e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max tPLH Propagation Delay 15 30 50 10 60 10 55 ns tPHL Data to Output (’F540) 10 20 40 10 45 10 40 tPZH Output Enable Time (’F540) 25 49 80 25 90 25 85 tPZL 35 58 100 35 110 35 105 ns tPHZ Output Disable Time (’F540) 15 34 60 15 70 15 65 tPLZ 10 25 55 10 75 10 60 tPLH Propagation Delay 15 33 55 15 60 ns tPHL Data to Output (’F541) 15 27 55 15 60 tPZH Output Enable Time (’F541) 30 58 80 25 95 tPZL 35 61 85 30 95 ns tPHZ Output Disable Time (’F541) 15 34 60 15 65 tPLZ 15 29 55 15 60 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 540541 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processing Device Type X e Devices shipped in 13 reel Package Code Temperature Range P e Plastic DIP C e Commercial (0 Cto a70 C) D e Ceramic DIP M e Military (b55 Cto a125 C) F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 4 |
Numéro de pièce similaire - 54F540 |
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Description similaire - 54F540 |
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