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KA-380 Fiches technique(PDF) 3 Page - Protek Devices

No de pièce KA-380
Description  HIGH POWERED TVS COMPONENT
Download  6 Pages
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Fabricant  PROTEC [Protek Devices]
Site Internet  http://www.protekdevices.com
Logo PROTEC - Protek Devices

KA-380 Fiches technique(HTML) 3 Page - Protek Devices

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Only One Name Means ProTek’Tion™
www.protekdevices.com
05459.R4 12/15
Page 3
K SERIES
TYPICAL DEVICE CHARACTERISTICS
TABLE 1 - STANDARD PACKAGE , LEADED PROCESS, PACKAGE PEAK REFLOW TEMPERATURE
Package Thickness
Volume mm3 < 350
Volume mm3 >= 350
< 2.5mm
240 +0/-5°C
225 +0/-5°C
>= 2.5mm
225 +0/-5°C
225 +0/-5°C
NOTES:
1. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes.
2. Volume of the package does not account for the external terminals.
3. Package volume is the equivalent of package size multipled by the height.
TABLE 2 - LEAD-FREE PROCESS, PACKAGE PEAK REFLOW TEMPERATURE
Package Thickness
Volume mm3 < 350
Volume mm3 250 - 2000
Volume mm3 > 2000
< 1.6mm
260 +0°C
260 +0°C
260 +0°C
1.6mm - 2.5mm
260 +0°C
250 +0°C
245 +0°C
>= 2.5mm
250 +0°C
245 +0°C
245 +0°C
NOTES:
1. The profiling tolerance is +0, -X °C but at no time will it exceed -5°C.
2. Volume of the package does not account for the external terminals.
3. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes.
4. Components used in lead-free assembly shall be evaluated using the lead-free classification temperature and profiles as defined in the above table.
5. Table 3 will help determine if the components are lead-free or not.
6. The device manufacturer/supplier shall ensure process compatibility up to and including the stated classification temperature at the rated MSL level.
TABLE 3 - CLASSIFICATION REFLOW PROFILES
Profile Feature
Sn - Pb Eutetectic Assembly
Pb-Free Assembly
Average Ramp Up Rate (T
SMAX to TP)
3°C/seconds Max.
3°C/seconds Max.
Preheat
Temperature Min T
SMIN
Temperature MAX T
SMAX
Time (T
SMIN to TSMAX) (ts)
100°C
150°C
60-120 seonds
150°C
200°C
60-180 seconds
Time Maintained Above
Temperature (T
L)
Time(t
L)
183°C
60-150 seconds
217°C
60-150 seconds
Peak/Classification Temperature (T
P)
See Table 1
See Table 2
Time Within 5°C of Actual Temperature (t
P)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6°C/seconds Max.
6°C/seconds Max.
Time 25°C to Peak Temperature
6 Minutes Max.
8 Minutes Max.
NOTES:
1. All temperatures refer to topside of the package, measured on the package body surface.
2. Time within 5°C of the actual peak temperature (T
P) specified for the reflow profiles is “supplier” minimum and “user” maximum.


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