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SN74AVCH4T245RSVR Fiches technique(PDF) 6 Page - Texas Instruments |
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SN74AVCH4T245RSVR Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 37 page SN74AVCH4T245 SCES577E – JUNE 2004 – REVISED NOVEMBER 2015 www.ti.com Recommended Operating Conditions (continued) see (1)(2)(3)(4)(5) VCCI VCCO MIN MAX UNIT 1.2 V to 1.95 V VCCA × 0.35 Low-level DIR VIL 1.95 V to 2.7 V 0.7 V input voltage (referenced to VCCA) (5) 2.7 V to 3.6 V 0.8 VI Input voltage 0 3.6 V Active state 0 VCCO VO Output voltage V 3-state 0 3.6 1.2 V –3 1.4 V to 1.6 V –6 IOH High-level output current 1.65 V to 1.95 V –8 mA 2.3 V to 2.7 V –9 3 V to 3.6 V –12 1.2 V 3 1.4 V to 1.6 V 6 IOL Low-level output current 1.65 V to 1.95 V 8 mA 2.3 V to 2.7 V 9 3 V to 3.6 V 12 Δt/Δv Input transition rise or fall rate 5 ns/V TA Operating free-air temperature –40 85 °C 7.4 Thermal Information SN74AVCH4T245 D (SOIC) DGV PW RGY RSV THERMAL METRIC(1) UNIT (TVSOP) (TSSOP) (VQFN) (UQFN) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance(2) 85.5 126.0 112.0 37.5 146.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 46.9 50.8 46.8 54.5 53.6 °C/W RθJB Junction-to-board thermal resistance 43.0 57.7 57.1 15.6 75.6 °C/W ψJT Junction-to-top characterization parameter 13.4 5.7 5.7 0.5 13.5 °C/W ψJB Junction-to-board characterization parameter 42.7 57.2 56.5 15.8 75.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 3.5 — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7. 6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: SN74AVCH4T245 |
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