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SN74HC165DG4 Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce SN74HC165DG4
Description  8-Bit Parallel-Load Shift Registers
Download  31 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

SN74HC165DG4 Fiches technique(HTML) 4 Page - Texas Instruments

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SN54HC165, SN74HC165
SCLS116H – DECEMBER 1982 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
Continuous current through VCC or GND
±50
mA
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1500
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VCC = 2 V
1.5
VIH
High-level input voltage
VCC = 4.5 V
3.15
V
VCC = 6 V
4.2
VCC = 2 V
0.5
VIL
Low level input voltage
VCC = 4.5 V
1.35
V
VCC = 6 V
1.8
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 2 V
1000
Δt/Δv(2)
Input transition rise and fall time
VCC = 4.5 V
500
ns/V
VCC = 6 V
400
SN54HC165
–55
125
TA
Operating free-air temperature
°C
SN74HC165
–40
125
(1)
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2)
If this device is used in the threshold region (from VIL max = 0.5 V to VIH min = 1.5 V), there is a potential to go into the wrong state from
induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device;
however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
6.4 Thermal Information
SN74HC165
THERMAL METRIC(1)
UNIT
D (SOIC)
DB (SSOP)
N (DIP)
NS (SO)
PW (TSSOP)
RθJA
Junction-to-ambient thermal resistance
73
82
67
64
108
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 1982–2015, Texas Instruments Incorporated
Product Folder Links: SN54HC165 SN74HC165


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