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TPD2E007

SLVS796H – SEPTEMBER 2008 – REVISED JANUARY 2016

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Copyright © 2008–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–13.5

13.5

V

Continuous power dissipation

YFM package

270

mW

DCK package

218

Operating temperature

–40

85

°C

Junction temperature

150

°C

Bump temperature (soldering)

Infrared (15 s)

220

°C

Vapor phase (60 s)

215

Lead temperature (soldering, 10 s)

300

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±15000

V

±1500

6.3 ESD Ratings: Surge Protection

VALUE

UNIT

Electrostatic

discharge

IEC 61000-4-2 ESD ratings

Contact

±8000

V

Air gap

±15000

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating voltage

–13

13

V

Operating temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information

TPD2E007

UNIT

DCK (SOT)

YFM (PicoStar)

3 PINS

4 PINS

Junction-to-ambient thermal resistance

251.9

175.9

°C/W

Junction-to-case (top) thermal resistance

115.4

39.2

°C/W

Junction-to-board thermal resistance

42.4

28.7

°C/W

Junction-to-top characterization parameter

9.4

8.3

°C/W

Junction-to-board characterization parameter

42.2

28.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W