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TL331KDBVRG4 Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce TL331KDBVRG4
Description  Single Differential Comparator
Download  18 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage(2)
0
36
V
VID
Differential input voltage(3)
–36
36
V
VI
Input voltage range (either input)
–0.3
36
V
VO
Output voltage
0
36
V
IO
Output current
0
20
mA
Duration of output short-circuit to ground(4)
Unlimited
TJ
Operating virtual junction temperature
–40
150
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to the network ground.
(3)
Differential voltages are at IN+ with respect to IN–.
(4)
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
±750
all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage
2
36
V
TJ
Junction Temperature
-40
125
°C
7.4 Thermal Information
TL331
THERMAL METRIC(1)
DBV
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
218.3
RθJC(top)
Junction-to-case (top) thermal resistance
87.3
RθJB
Junction-to-board thermal resistance
44.9
°C/W
ψJT
Junction-to-top characterization parameter
4.3
ψJB
Junction-to-board characterization parameter
44.1
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Product Folder Links: TL331


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