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TL974IPWR Fiches technique(PDF) 4 Page - Texas Instruments |
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TL974IPWR Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 33 page ![]() TL971, TL972, TL974 SLOS467H – OCTOBER 2006 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage range 2.7 15 V VID Differential input voltage(2) ±1 V V VIN Input voltage range(3) VCC– – 0.3 VCC+ + 0.3 V TJ Maximum junction temperature 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Differential voltages for the noninverting input terminal are with respect to the inverting input terminal. (3) The input and output voltages must never exceed VCC + 0.3 V. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, 1500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage 2.7 12 V VICM Common-mode input voltage VCC– + 1.15 VCC+ – 1.15 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information THERMAL METRIC(1) TL971 TL972 TL974 D(2) DBV(2) D(2) DGK(3) DRG(3) P(2) PW(2) D(2) N(2) PW(2) UNIT 8 PINS 5 PINS 8 PINS 14 PINS Package thermal RθJA impedance, 97 206 97 172 44 85 149 86 80 113 °C/W junction to free air (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). (2) Package thermal impedance is calculated in accordance with JESD 51-7. (3) Package thermal impedance is calculated in accordance with JESD 51-5. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL971 TL972 TL974 |
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