OUT A

V+

1

10

-IN A

OUT B

2

9

+IN A

-IN B

3

8

GND

+IN B

4

7

N/C

N/C

5

6

LM158QML

SNOSAP3F – JULY 2005 – REVISED MARCH 2013

www.ti.com

Connection Diagrams

Figure 1. TO-99 Package

See Package Number LMC0008C

Top View

Top View

Figure 2. CDIP Package

Figure 3. 10 Lead CLGA Package

See Package Number NAB0008A

See Package Number NAC0010A

Schematic Diagram

(Each Amplifier)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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