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LM26CIM5-ZHA Fiches technique(PDF) 4 Page - Texas Instruments |
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LM26CIM5-ZHA Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 24 page LM26 SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015 www.ti.com 6 Pin Configuration and Functions DBV Package 5-Pin SOT-23 (Top View) Pin Functions PIN TYPE DESCRIPTION NO. NAME 1 HYST Input Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C Power Ground, connected to the back side of the die through lead frame; connect to 2 GND system ground Output Analog output voltage proportional to temperature; leave floating or connect to a 3 VTEMP high impedance node. 4 V+ Power Supply input; connect to 2.7 V to 5.5 V with a 0.1- μF bypass capacitor. Output Overtemperature Shutdown open-drain active low thermostat digital output; OS connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 k Ω OS Output Overtemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown 5(1) US Output Undertemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 k Ω US Output Undertemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown (1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input Voltage 6 V Input Current at any pin (2) 5 mA Package Input Current (2) 20 mA Package Dissipation at TA = 25°C (3) 500 mW Vapor Phase (60 seconds) 215 Soldering SOT-23 Package °C Information(4) Infrared (15 seconds) 220 Storage Temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V +), the current at that pin should be limited to 5 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX = 150°C. For this device the typical thermal resistance ( θJA) of the different package types when board mounted follow: (4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices. 4 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: LM26 |
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