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BYC5-600P Fiches technique(PDF) 5 Page - NXP Semiconductors |
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BYC5-600P Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 11 page NXP Semiconductors BYC5-600P Hyperfast power diode BYC5-600P All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved Product data sheet 24 December 2014 5 / 11 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base with heatsink compound; Fig. 5 - - 3.5 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W aaa-015785 tp (s) 10-6 1 10 10-1 10-2 10-5 10-3 10-4 10-2 10-3 1 10-1 10 Zth(j-mb) (K/W) 10-4 δ = 0.5 δ = 0.3 δ = 0.1 δ = 0.05 δ = 0.02 δ = 0.01 single pulse tp tp T P t T δ = Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration |
Numéro de pièce similaire - BYC5-600P_15 |
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Description similaire - BYC5-600P_15 |
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