SA, SB, SC

www.vishay.com

Vishay Sfernice

Revision: 13-Mar-15

1

Document Number: 53013

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Current Sensing Wirebondable Thin Film Chip Resistors

This thin film chip resistor fits applications as force balance

scales, E beam deflection systems, switching power

supplies, etc... all rely on current sensors to feed back and

control the current.

Gold pads are compatible with thermosonic or ultrasonic

bonding of gold and aluminum wires.

FEATURES

• Low ohmic value down to 0.05



• Tolerance down to 1 %

• Stability 0.1 % < 2000 h at Pn at +70 °C

• Low noise < -35 dB

• Low TCR 100 ppm/°C

• Wirebondable

• Material categorization: for definitions of

DERATING CURVE

Note

• Higher values and higher tolerances on request.

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

SIZE

RESISTANCE

RANGE



RATED POWER

W

TOLERANCE

± %

TEMPERATURE

COEFFICIENT

± ppm/°C

SA

0606

0.05 to 1

0.5

1, 2, 5

100

SB

1212

0.05 to 1

2

1, 2, 5

100

SC

2020

0.05 to 1

6

1, 2, 5

100

CLIMATIC SPECIFICATIONS

Operating temperature range

-55 °C to +125 °C

Storage temperature range

-55 °C to +155 °C

MECHANICAL SPECIFICATIONS

Substrate

Alumina

Resistive element

NiCr

Glassivation

Bonding pads

Gold

Backside metallization

On request Ni Au

0

20

40

60

80

100

Ambient Temperature in °C

120

0

20

40

60

80

100

120

140

TOLERANCE VS. OHMIC VALUE

OHMIC VALUE RANGE



TOLERANCE

± %

0.05

 R < 1

5

0.2

 R < 1

2

0.5

 R < 1

1