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BAS116TT1 Fiches technique(PDF) 1 Page - ON Semiconductor |
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BAS116TT1 Fiches technique(HTML) 1 Page - ON Semiconductor |
1 / 3 page © Semiconductor Components Industries, LLC, 2011 September, 2011 − Rev. 1 1 Publication Order Number: BAS116TT1/D BAS116TT1G Switching Diode Features • Low Leakage Current Applications • Medium Speed Switching Times • Available in 8 mm Tape and Reel • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TA = 25°C) Rating Symbol Max Unit Continuous Reverse Voltage VR 75 V Peak Forward Current IF 200 mA Peak Forward Surge Current IFM(surge) 500 mA THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation, FR−4 Board (Note 1) TA = 25°C Derated above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 555 °C/W Total Device Dissipation, FR−4 Board (Note 2) TA = 25°C Derated above 25°C PD 360 2.9 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 345 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 @ Minimum Pad 2. FR−4 @ 1.0 × 1.0 Inch Pad http://onsemi.com Device Package Shipping† ORDERING INFORMATION CASE 463 SOT−416 STYLE 2 MARKING DIAGRAM 3 CATHODE 1 ANODE BAS116TT1G SOT−416 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 2 3 AE MG G 1 AE = Specific Device Code M = Date Code G = Pb−Free Package |
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