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TPS566250DDAR Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS566250DDAR Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 32 page TPS566250 SLVSCV3B – MARCH 2015 – REVISED JUNE 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN, EN –0.3 19 BOOT –0.3 25 BOOT (10ns transient) –0.3 27 Input voltage range BOOT (vs SW) –0.3 6.5 V FB, SDA, SCL –0.3 3.6 SW –2 19 SW (10ns transient) –3.5 21 Operating Junction temperature, TJ –40 150 °C Storage temperature, TSTG –55 150 °C (1) These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. (2) All voltages are with respect to IC GND terminal. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply input voltage range 4.5 17 BOOT –0.1 23 BOOT (10 ns transient) –0.1 26 BOOT (vs SW) –0.1 6 VIN V Input voltage range EN –0.1 17 FB, SDA, SCL –0.1 3.3 SW –1.8 17 SW (10 ns transient) –3.5 20 TJ Operating junction temperature range –40 150 °C 7.4 Thermal Information TPS566250 THERMAL METRIC(1) UNIT DDA (8) RθJA Junction-to-ambient thermal resistance 42.1 RθJCtop Junction-to-case (top) thermal resistance 55.7 RθJB Junction-to-board thermal resistance 24.9 °C/W ψJT Junction-to-top characterization parameter 9.5 ψJB Junction-to-board characterization parameter 24.9 RθJCbot Junction-to-case (bottom) thermal resistance 3.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPS566250 |
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