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TPS566250DDAR Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce TPS566250DDAR
Description  TPS566250 4.5-V to 17-V Input, 6-A Synchronous Step-Down Converter With VID Control
Download  32 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TPS566250DDAR Fiches technique(HTML) 4 Page - Texas Instruments

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TPS566250
SLVSCV3B – MARCH 2015 – REVISED JUNE 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN, EN
–0.3
19
BOOT
–0.3
25
BOOT (10ns transient)
–0.3
27
Input voltage range
BOOT (vs SW)
–0.3
6.5
V
FB, SDA, SCL
–0.3
3.6
SW
–2
19
SW (10ns transient)
–3.5
21
Operating Junction temperature, TJ
–40
150
°C
Storage temperature, TSTG
–55
150
°C
(1)
These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions.
(2)
All voltages are with respect to IC GND terminal.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply input voltage range
4.5
17
BOOT
–0.1
23
BOOT (10 ns transient)
–0.1
26
BOOT (vs SW)
–0.1
6
VIN
V
Input voltage range
EN
–0.1
17
FB, SDA, SCL
–0.1
3.3
SW
–1.8
17
SW (10 ns transient)
–3.5
20
TJ
Operating junction temperature range
–40
150
°C
7.4 Thermal Information
TPS566250
THERMAL METRIC(1)
UNIT
DDA (8)
RθJA
Junction-to-ambient thermal resistance
42.1
RθJCtop
Junction-to-case (top) thermal resistance
55.7
RθJB
Junction-to-board thermal resistance
24.9
°C/W
ψJT
Junction-to-top characterization parameter
9.5
ψJB
Junction-to-board characterization parameter
24.9
RθJCbot
Junction-to-case (bottom) thermal resistance
3.5
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Product Folder Links: TPS566250


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