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CS3717A Fiches technique(PDF) 7 Page - ON Semiconductor

No de pièce CS3717A
Description  1A H-Bridge Stepper Motor Driver
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Fabricant  ONSEMI [ON Semiconductor]
Site Internet  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS3717A Fiches technique(HTML) 7 Page - ON Semiconductor

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7
Application Circuit - Two Phase Bipolar Stepper Motor Driver
1
VS
1k
RC
CC
0.1
µF
CS-3717A
C2
C1 100
µF
820pF
1k
RC
1
RSense
CC
820pF
CT
820pF
CT
820pF
Comp In
Gnd
IN0
56k
RT
56k
RT
CS3717A
IMA
IMB
MBA
MAA
STEPPER
MOTOR
VSS
0.1
µF C3
FROM
µ PROCESSOR
Gnd
Sense
Out B
OutA
V
DD
A
V
DD
B
V
CC
VREF
IN1
DIRECTION
Pulse
VCC
VREF
Sense
Gnd
Pulse
DIRECTION
IN0
IN1
VDD
A
OUTA
OUTB
VDD
B
Gnd
RSense
CS3717A
COMP IN
The RΘJA of the CS3717A can be reduced by soldering the
Gnd pins to a suitable copper area of the printed circuit
board or to an external heatsink.
The diagram of fig. 2 shows the maximum dissipated
power Ptot and the RΘJA as a function of the side “l ” of
two equal square copper areas having a thickness of 35µ
(see fig. 1). In addition, it is possible to use an external
heatsink (see fig. 3). During soldering the pins tempera-
ture must not exceed 260°C and the soldering time must
not be longer than 12 seconds.
The external heatsink or printed circuit copper area must
be connected to electrical ground.
Mounting Instructions
Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal
Resistance vs. Size “l” for 16 lead fused package.
1
2
3
4
Ptot
(W)
10
20
30
40
I(mm)
0
0
20
40
60
80
(˚C/W)
0
“l”
Ptot (Tamb = 70˚C)
Rθ JA
Rθ JA
l
l
COPPER AREA 35
µ THICKNESS
P.C. BOARD
Figure 1 - Example of P.C. Board Copper Area Which is Used as
Heatsink with 16 lead fused package.
170mm
38.0mm
11.9mm
0
-50
1
2
3
4
5
Ptot
(W)
0
50
100
Tamb (C)
FREE
AIR
HEA
T -
SINK
WITH
R
th = 25˚C/W
Figure 3 - External Heatsink Mounting Example (Rth = 30°C/W) for 16
lead batwing package.
Figure 4 - Maximum Allowable Power Dissipation vs. Ambient
Temperature for 16 lead batwing package.


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