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CS3717A Fiches technique(PDF) 7 Page - ON Semiconductor |
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CS3717A Fiches technique(HTML) 7 Page - ON Semiconductor |
7 / 8 page 7 Application Circuit - Two Phase Bipolar Stepper Motor Driver 1 Ω VS 1k Ω RC CC 0.1 µF CS-3717A C2 C1 100 µF 820pF 1k Ω RC 1 Ω RSense CC 820pF CT 820pF CT 820pF Comp In Gnd IN0 56k Ω RT 56k Ω RT CS3717A IMA IMB MBA MAA STEPPER MOTOR VSS 0.1 µF C3 FROM µ PROCESSOR Gnd Sense Out B OutA V DD A V DD B V CC VREF IN1 DIRECTION Pulse VCC VREF Sense Gnd Pulse DIRECTION IN0 IN1 VDD A OUTA OUTB VDD B Gnd RSense CS3717A COMP IN The RΘJA of the CS3717A can be reduced by soldering the Gnd pins to a suitable copper area of the printed circuit board or to an external heatsink. The diagram of fig. 2 shows the maximum dissipated power Ptot and the RΘJA as a function of the side “l ” of two equal square copper areas having a thickness of 35µ (see fig. 1). In addition, it is possible to use an external heatsink (see fig. 3). During soldering the pins tempera- ture must not exceed 260°C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Mounting Instructions Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal Resistance vs. Size “l” for 16 lead fused package. 1 2 3 4 Ptot (W) 10 20 30 40 I(mm) 0 0 20 40 60 80 (˚C/W) 0 “l” Ptot (Tamb = 70˚C) Rθ JA Rθ JA l l COPPER AREA 35 µ THICKNESS P.C. BOARD Figure 1 - Example of P.C. Board Copper Area Which is Used as Heatsink with 16 lead fused package. 170mm 38.0mm 11.9mm 0 -50 1 2 3 4 5 Ptot (W) 0 50 100 Tamb (C) FREE AIR HEA T - SINK WITH R th = 25˚C/W Figure 3 - External Heatsink Mounting Example (Rth = 30°C/W) for 16 lead batwing package. Figure 4 - Maximum Allowable Power Dissipation vs. Ambient Temperature for 16 lead batwing package. |
Numéro de pièce similaire - CS3717A |
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Description similaire - CS3717A |
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