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TPS63060 Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce TPS63060
Description  TPS6306x High Input Voltage, Buck-Boost Converter With 2-A Switch Current
Download  30 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TPS63060 Fiches technique(HTML) 4 Page - Texas Instruments

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TPS63060, TPS63061
SLVSA92B – DECEMBER 2011 – REVISED DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
EN, FB, PS/SYNC, VIN, VOUT, FB, PG, L2
–0.3
17
V
Voltage range
L1
–0.3
VIN + 0.3
V
VAUX
–0.3
7.5
V
Operating virtual junction temperature range, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±3000
V(ESD)
Electrostatic discharge
Machine model (MM)
±200
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
Supply voltage at VIN
2.5
12
V
Output current IOUT
(1)
1
A
Operating free air temperature range, TA
–40
85
°C
Operating virtual junction temperature range, TJ
–40
125
°C
(1)
10
≤ VIN ≤ 12 V
7.4 Thermal Information
TPS63060
TPS63061
THERMAL METRIC(1)
UNIT
DSC
10 PINS
RθJA
Junction-to-ambient thermal resistance
48.7
RθJC(top)
Junction-to-case (top) thermal resistance
54.8
RθJB
Junction-to-board thermal resistance
19.8
°C/W
ψJT
Junction-to-top characterization parameter
1.1
ψJB
Junction-to-board characterization parameter
19.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: TPS63060 TPS63061


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