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TPS63060 Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS63060 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 30 page TPS63060, TPS63061 SLVSA92B – DECEMBER 2011 – REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT EN, FB, PS/SYNC, VIN, VOUT, FB, PG, L2 –0.3 17 V Voltage range L1 –0.3 VIN + 0.3 V VAUX –0.3 7.5 V Operating virtual junction temperature range, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V(ESD) Electrostatic discharge Machine model (MM) ±200 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage at VIN 2.5 12 V Output current IOUT (1) 1 A Operating free air temperature range, TA –40 85 °C Operating virtual junction temperature range, TJ –40 125 °C (1) 10 ≤ VIN ≤ 12 V 7.4 Thermal Information TPS63060 TPS63061 THERMAL METRIC(1) UNIT DSC 10 PINS RθJA Junction-to-ambient thermal resistance 48.7 RθJC(top) Junction-to-case (top) thermal resistance 54.8 RθJB Junction-to-board thermal resistance 19.8 °C/W ψJT Junction-to-top characterization parameter 1.1 ψJB Junction-to-board characterization parameter 19.6 RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: TPS63060 TPS63061 |
Numéro de pièce similaire - TPS63060_15 |
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Description similaire - TPS63060_15 |
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