TPS63020, TPS63021

SLVS916D – JULY 2010 – REVISED OCTOBER 2015

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6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage at VIN, VINA

1.8

5.5

V

–40

85

°C

–40

125

°C

6.4 Thermal Information

TPS6302x

DSJ (VSON)

UNIT

14 PINS

Junction-to-ambient thermal resistance

41.8

°C/W

Junction-to-case(top) thermal resistance

47

°C/W

Junction-to-board thermal resistance

17

°C/W

Junction-to-top characterization parameter

0.9

°C/W

Junction-to-board characterization parameter

16.8

°C/W

Junction-to-case(bottom) thermal resistance

3.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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