Moteur de recherche de fiches techniques de composants électroniques |
|
TPS62150A-Q1 Fiches technique(PDF) 4 Page - Texas Instruments |
|
|
TPS62150A-Q1 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 35 page TPS62150A-Q1, TPS62153A-Q1 SLVSCC3 – MAY 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings (1) MIN MAX UNIT AVIN, PVIN –0.3 20 V Pin voltage(2) EN, SS/TR, SW –0.3 VIN+0.3 DEF, LOG, FB, PG, VOS –0.3 7 V Power Good sink current PG 10 mA Temperature Operating junction temperature range, TJ –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 8.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per AEC Q100-002(2) –2000 2000 Electrostatic V(ESD) (1) V discharge Charged device model (CDM), per AEC Q100-011 –500 500 (1) Electrostatic discharge (ESD) measures device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device. (2) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply Voltage, VIN (at AVIN and PVIN) 3 17 V Output Voltage Range, VOUT (TPS62150A-Q1) 0.9 6 V Operating junction temperature, TJ –40 125 °C 8.4 Thermal Information TPS6215xA-Q1 THERMAL METRIC(1) RGT UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 29.1 RθJC(top) Junction-to-case (top) thermal resistance 15 RθJB Junction-to-board thermal resistance 11 °C/W ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 10 RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS62150A-Q1 TPS62153A-Q1 |
Numéro de pièce similaire - TPS62150A-Q1 |
|
Description similaire - TPS62150A-Q1 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |