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TPS60243 Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS60243 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 22 page TPS60240, TPS60241, TPS60242, TPS60243 SLVS372C – JUNE 2001 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage –0.3 6 V PD Power dissipation Internally limited Voltage EN –0.3 6 V Voltage C2–, C1– –0.3 VIN or 5.5 (2) V Voltage C2+, C1+ –0.3 VIN, VOUT, or 5.5 (2) V TJ Junction temperature 125 °C Short circuit output current 80 mA Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Whichever is lowest. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TPS60240, TPS60242, TPS60243 1.8 5.5 VIN Input voltage V TPS60241 2.7 5.5 IOUT Output current All devices 25 mA CIN Input capacitor 1 µF C1, C2 Flying capacitors 1 µF COUT Output capacitor 1 µF TA Operating temperature –40 85 °C 6.4 Thermal Information TPS6024x THERMAL METRIC(1) DGK (VSSOP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 174 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66 °C/W RθJB Junction-to-board thermal resistance 95 °C/W ψJT Junction-to-top characterization parameter 8.8 °C/W ψJB Junction-to-board characterization parameter 94 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: TPS60240 TPS60241 TPS60242 TPS60243 |
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