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TPS57140-Q1 Fiches technique(PDF) 5 Page - Texas Instruments

No de pièce TPS57140-Q1
Description  1.5-A 42-V STEP-DOWN SWIFT??DC-DC CONVERTER WITH Eco-mode??CONTROL
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
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TPS57140-Q1 Fiches technique(HTML) 5 Page - Texas Instruments

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TPS57140-Q1
www.ti.com
SLVSAP3B – DECEMBER 2010 – REVISED MARCH 2013
DEVICE INFORMATION
PIN FUNCTIONS
PIN
I/O
DESCRIPTION
NAME
NO.
The device requires a bootstrap capacitor between BOOT and PH. A voltage on this capacitor below the
BOOT
1
O
minimum required by the output device forces the output is forced to switch off pending a referesh of the
capacitor.
Error-amplifier output, and input to the output-switch current comparator. Connect frequency-compensation
COMP
8
O
components to this pin.
Enable pin, internal pullup current source. Pull below 1.2 V to disable. Float to enable. Adjust the input
EN
3
I
undervoltage lockout with two resistors.
GND
9
Ground
PH
10
I
The source of the internal high-side power MOSFET
An open-drain output, asserts low if output voltage is low due to thermal shutdown, dropout, overvoltage, or
PWRGD
6
O
EN shutdown.
Resistor timing and external clock. An internal amplifier holds this pin at a fixed voltage when using an
external resistor to ground to set the switching frequency. Pulling the pin above the PLL upper threshold
RT/CLK
5
I
causes a mode change whereby the pin becomes a synchronization input. Disabling of the internal amplifier
occurs, and the pin is a high-impedance clock input to the internal PLL. If clocking edges stop, re-enabling of
the internal amplifier occurs, and the mode returns to a resistor-set function.
Slow-start and tracking. An external capacitor connected to this pin sets the output rise time. The voltage on
SS/TR
4
I
this pin overrides the internal reference, allowing use of the pin for tracking and sequencing.
VIN
2
I
Input supply voltage, 3.5 V to 42 V
VSENSE
7
I
Inverting node of the transconductance (gm) error amplifier
GND pin must have an electrical connection to the exposed pad on the printed-circuit board for proper
Thermal pad
operation.
Copyright © 2010–2013, Texas Instruments Incorporated
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