TPS54295

SLVSB01C – OCTOBER 2011 – REVISED APRIL 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING PART

PACKAGE

PINS

OUTPUT SUPPLY

ECO PLAN

NUMBER

TPS54295PWPR

Tape-and-Reel

Green (RoHS and no

PWP

16

Sb/Br)

TPS54295PWP

Tube

–40

℃ to 85℃

TPS54295RSAR

Tape-and-Reel

Green (RoHS and no

RSA

16

Sb/Br)

TPS54295RSAT

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1) (2)

VALUE

UNIT

VIN1, VIN2, EN1, EN2

–0.3 to 20

VBST1, VBST2

–0.3 to 26

VBST1, VBST2 (10ns transient)

–0.3 to 28

Input voltage range

VBST1–SW1 , VBST2–SW2

–0.3 to 6.5

V

VFB1, VFB2

–0.3 to 6.5

SW1, SW2

–2 to 20

SW1, SW2 (10ns transient)

–3 to 22

VREG5, SS1, SS2

–0.3 to 6.5

Output voltage range

V

PGND1, PGND2

–0.3 to 0.3

Human Body Model (HBM)

2

kV

Electrostatic discharge

Charged Device Model (CDM)

500

V

Operating ambient temperature range

–40 to 85

°C

Storage temperature range

–55 to 150

°C

Junction temperature range

–40 to 150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to IC GND terminal.

THERMAL INFORMATION

TPS54295

UNITS

PWP (16) PINS

RSA (16) PINS

Junction-to-ambient thermal resistance

47.5

34.9

Junction-to-case (top) thermal resistance

27.1

40.0

Junction-to-board thermal resistance

20.8

11.8

°C/W

Junction-to-top characterization parameter

1.0

0.7

Junction-to-board characterization parameter

20.6

11.3

Junction-to-case (bottom) thermal resistance

2.7

3.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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