TPS53211

SLUSAA9A – SEPTEMBER 2011 – REVISED NOVEMBER 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

ORDERABLE

MINIMUM

TA

PACKAGE

PINS

OUTPUT SUPPLY

ECO PLAN

DEVICE NUMBER

QUANTITY

TPS53211RGTR

Tape and Reel

3000

Plastic QFN

Green (RoHS and

–40°C to 85°C

16

(RGT)

no Pb/Br)

TPS53211RGTT

Mini Reel

250

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNITS

VCC, EN

–0.3

15

VCCDR

–0.3

7.7

BOOT

dc

–0.3

36

dc

–0.3

7.7

BOOT to PHASE

transient < 200 ns

–5

7.7

V

dc

–3

26

PHASE

transient < 200 ns

–5

30

FB, VSEN, OSC

–0.3

3.6

–0.7

6

CSP, CSN

–0.7

VCC-1.5

UGATE

–0.3

36

dc

–0.3

7.7

UGATE to PHASE,

Output voltage

LGATE

transient < 200 ns

–5

7.7

V

COMP

–0.3

3.6

PGOOD

–0.3

15

GND

–0.3

0.3

Ground pins

V

FBG

–0.3

0.3

Human Body Model (HBM)

1500

Electrostatic

V

discharge

Charged Device Model (CDM)

500

Storage junction temperature

–55

150

°C

Operating junction temperature

–40

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted.

(3)

Voltage values are with respect to the SW terminal.

THERMAL INFORMATION

TPS53211

QFN

UNITS

16 PINS

Junction-to-ambient thermal resistance

51.3

Junction-to-case (top) thermal resistance

85.4

Junction-to-board thermal resistance

20.1

°C/W

Junction-to-top characterization parameter

1.3

Junction-to-board characterization parameter

19.4

Junction-to-case (bottom) thermal resistance

6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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