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TPS53211 Fiches technique(PDF) 2 Page - Texas Instruments |
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TPS53211 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 22 page TPS53211 SLUSAA9A – SEPTEMBER 2011 – REVISED NOVEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION ORDERABLE MINIMUM TA PACKAGE PINS OUTPUT SUPPLY ECO PLAN DEVICE NUMBER QUANTITY TPS53211RGTR Tape and Reel 3000 Plastic QFN Green (RoHS and –40°C to 85°C 16 (RGT) no Pb/Br) TPS53211RGTT Mini Reel 250 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNITS VCC, EN –0.3 15 VCCDR –0.3 7.7 BOOT dc –0.3 36 dc –0.3 7.7 BOOT to PHASE transient < 200 ns –5 7.7 Input voltage range(2) V dc –3 26 PHASE transient < 200 ns –5 30 FB, VSEN, OSC –0.3 3.6 VVCC > 7.5 V –0.7 6 CSP, CSN VVCC ≤ 7.5 V –0.7 VCC-1.5 UGATE –0.3 36 dc –0.3 7.7 UGATE to PHASE, Output voltage LGATE transient < 200 ns –5 7.7 V range(3) COMP –0.3 3.6 PGOOD –0.3 15 GND –0.3 0.3 Ground pins V FBG –0.3 0.3 Human Body Model (HBM) 1500 Electrostatic V discharge Charged Device Model (CDM) 500 Storage junction temperature –55 150 °C Operating junction temperature –40 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal unless otherwise noted. (3) Voltage values are with respect to the SW terminal. THERMAL INFORMATION TPS53211 THERMAL METRIC(1) QFN UNITS 16 PINS θJA Junction-to-ambient thermal resistance 51.3 θJCtop Junction-to-case (top) thermal resistance 85.4 θJB Junction-to-board thermal resistance 20.1 °C/W ψJT Junction-to-top characterization parameter 1.3 ψJB Junction-to-board characterization parameter 19.4 θJCbot Junction-to-case (bottom) thermal resistance 6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated |
Numéro de pièce similaire - TPS53211_15 |
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Description similaire - TPS53211_15 |
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