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TPS544C20 Fiches technique(PDF) 6 Page - Texas Instruments

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No de pièce TPS544C20
Description  TPS544x20 4.5-V to 18-V, 20-A, and 30-A SWIFT??Synchronous Buck Converters with PMBus?
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
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TPS544C20 Fiches technique(HTML) 6 Page - Texas Instruments

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TPS544B20, TPS544C20
SLUSB69 – MAY 2014
www.ti.com
7.4 Thermal Information
TPS544B20
THERMAL METRIC(1)
UNIT
TPS544C20
RθJA
Junction-to-ambient thermal resistance(2)
27.5
RθJCtop
Junction-to-case (top) thermal resistance(3)
13.9
RθJB
Junction-to-board thermal resistance
4.0
°C/W
ψJT
Junction-to-top characterization parameter(4)
0.3
ψJB
Junction-to-board characterization parameter(5)
3.9
RθJCbot
Junction-to-case (bottom) thermal resistance(6)
0.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(5)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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