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LM27341-Q1 Fiches technique(PDF) 3 Page - Texas Instruments |
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LM27341-Q1 Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 44 page LM27341, LM27342, LM27341-Q1, LM27342-Q1 www.ti.com SNVS497E – NOVEMBER 2008 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) AVIN, PVIN -0.5V to 24V SW Voltage -0.5V to 24V Boost Voltage -0.5V to 28V Boost to SW Voltage -0.5V to 6.0V FB Voltage -0.5V to 3.0V SYNC Voltage -0.5V to 6.0V EN Voltage -0.5V to (VIN + 0.3V) Storage Temperature Range −65°C to +150°C Junction Temperature 150°C ESD Susceptibility(3) 2kV Soldering Information Infrared Reflow (5sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and should not be operated beyond such conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human body model, 1.5 k Ω in series with 100 pF. Operating Ratings (1) AVIN, PVIN 3V to 20V SW Voltage -0.5V to 20V Boost Voltage -0.5V to 24V Boost to SW Voltage 3.0V to 5.5V Junction Temperature Range −40°C to +125°C Thermal Resistance ( θJA) SON (2) 33°C/W Thermal Resistance ( θJA) MSOP-PowerPad (2) 45°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and should not be operated beyond such conditions. (2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM27341 LM27342 LM27341-Q1 LM27342-Q1 |
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