LM3671, LM3671-Q1

SNVS294R – NOVEMBER 2004 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

−0.2

6

V

FB, SW, EN pins:

GND

−0.2

V

Internally

Limited

125

°C

Maximum lead temperature

260

°C

(soldering, 10 sec.)

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

6.2 Handling Ratings: LM3671

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

0.5

Machine model

200

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM3671-Q1

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

2

Corner pins (1, 3, 4, and 5):

SOT-23

kV

Charged device model

Electrostatic discharge

0.75

(CDM), per AEC Q100-011

Corner pins (A1, A3, C1, and

C3): DSBGA

Machine model

200

V

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

4

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