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LM1084 Fiches technique(PDF) 4 Page - Texas Instruments |
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LM1084 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 29 page LM1084 SNVS037G – SEPTEMBER 1999 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Maximum Input to Output Voltage Differential LM1084-ADJ 29 V LM1084-3.3 27 V LM1084-5.0 25 V Power Dissipation(3) Internally Limited Junction Temperature (TJ) (4) 150 °C Lead Temperature 260, to 10 sec °C Storage temperature, Tstg –65 150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery. (4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Junction Temperature Range (TJ) (2) Control Section –40 125 °C Output Section –40 150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations. 6.4 Thermal Information LM1084 THERMAL METRIC(1) KTT NDE UNIT 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 40.4 22.7 RθJC(top) Junction-to-case (top) thermal resistance 42.6 15.5 RθJB Junction-to-board thermal resistance 23.0 4.1 °C/W ψJT Junction-to-top characterization parameter 9.8 2.1 ψJB Junction-to-board characterization parameter 22.0 4.1 RθJC(bot) Junction-to-case (bottom) thermal resistance: Control Section/Output 0.65/2.7 0.65/2.7 Section (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: LM1084 |
Numéro de pièce similaire - LM1084_15 |
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Description similaire - LM1084_15 |
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