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CSD87588N Fiches technique(PDF) 5 Page - Texas Instruments

No de pièce CSD87588N
Description  CSD87588N Synchronous Buck NexFET Power Block II
Download  23 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

CSD87588N Fiches technique(HTML) 5 Page - Texas Instruments

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Ambient Temperature (ºC)
400LFM
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Nat Conv
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Board Temperature (ºC)
VIN = 12V
VGS = 5V
VOUT = 1.3V
fSW = 500kHz
LOUT = 0.29µH
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Output Current (A)
VIN = 12V
VGS = 5V
VOUT = 1.3V
fSW = 500kHz
LOUT = 0.29µH
G001
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Junction Temperature (ºC)
VIN = 12V
VGS = 5V
VOUT = 1.3V
fSW = 500kHz
LOUT = 0.29µH
G001
CSD87588N
www.ti.com
SLPS384D – MARCH 2013 – REVISED APRIL 2015
Max RθJA = 70°C/W
Max RθJA = 170°C/W
when mounted on
when mounted on
1 inch2 (6.45 cm2) of
minimum pad area of
2 oz. (0.071 mm thick)
2 oz. (0.071 mm thick)
Cu.
Cu.
5.6 Typical Power Block Device Characteristics
TJ = 125°C, unless stated otherwise.The Typical Power Block System Characteristic curves Figure 3 and Figure 4 are based
on measurements made on a PCB design with dimensions of 4.0 inches (W) × 3.5 inches (L) × 0.062 inch (H) and 6 copper
layers of 1 oz. copper thickness. See Application and Implementation for detailed explanation.
Figure 1. Power Loss vs Output Current
Figure 2. Normalized Power Loss vs Temperature
Figure 3. Safe Operating Area – PCB Horizontal Mount
Figure 4. Typical Safe Operating Area
Copyright © 2013–2015, Texas Instruments Incorporated
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