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IRFE230 Fiches technique(PDF) 1 Page - International Rectifier |
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IRFE230 Fiches technique(HTML) 1 Page - International Rectifier |
1 / 7 page The leadless chip carrier (LCC) package represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference. 01/27/15 www.irf.com 1 LCC-18 Product Summary Part Number BVDSS RDS(on) ID IRFE230 200V 0.40 Ω 5.5A Features: n Surface Mount n Small Footprint n Alternative to TO-39 Package n Hermetically Sealed n Dynamic dv/dt Rating n Avalanche Energy Rating n Simple Drive Requirements n Light Weight For footnotes refer to the last page REPETITIVE AVALANCHE AND dv/dt RATED JANTX2N6798U HEXFET ® TRANSISTORS JANTXV2N6798U SURFACE MOUNT (LCC-18) REF:MIL-PRF-19500/557 IRFE230 200V, N-CHANNEL n ESD Rating: Class 1C per MIL-STD-750, Method 1020 Absolute Maximum Ratings Parameter Units ID @ VGS = 10V, TC = 25°C Continuous Drain Current 5.5 ID @ VGS = 10V, TC = 100°C Continuous Drain Current 3.5 IDM Pulsed Drain Current À 22 PD @ TC = 25°C Max. Power Dissipation 25 W Linear Derating Factor 0.20 W/°C VGS Gate-to-Source Voltage ±20 V EAS Single Pulse Avalanche Energy Á 110 mJ IAR Avalanche Current À 5.5 A EAR Repetitive Avalanche Energy À 2.5 mJ dv/dt Peak Diode Recovery dv/dt  6.3 V/ns TJ Operating Junction -55 to 150 TSTG Storage Temperature Range °C Pckg. Mounting Surface Temp. 300 (for 5 S) Weight 0.42 (typical) g A PD-91715C |
Numéro de pièce similaire - IRFE230 |
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Description similaire - IRFE230 |
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