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UPD6376 Fiches technique(PDF) 16 Page - NEC |
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UPD6376 Fiches technique(HTML) 16 Page - NEC |
16 / 20 page µPD6376 16 8. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met when performing soldering for the µPD6376. For more detailed information, refer to the information document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than the recommended conditions, please consult with an NEC sales representative. Surface Mount Type Soldering Conditions µPD6376GS: 16-pin Plastic SOP (300 mil) Soldering Process Soldering Conditions Symbol Infrared reflow Peak package temperature: 230 °C, Time: 30 seconds max. (at 210°C or higher), IR30-00-1 Count: Once VPS Peak package temperature: 215 °C, Time: 40 seconds max. (at 200°C or higher), VP-15-00-1 Count: Once Pin Partial heating Pin temperature: 300 °C or less, Time: 3 seconds max. (per pin row) –– Caution Do not use different soldering methods together (except for pin partial heating). |
Numéro de pièce similaire - UPD6376 |
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Description similaire - UPD6376 |
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