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IRF5210S Fiches technique(PDF) 2 Page - International Rectifier |
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IRF5210S Fiches technique(HTML) 2 Page - International Rectifier |
2 / 10 page IRF5210S/L Starting T J = 25°C, L = 3.1mH RG = 25Ω, IAS = -21A. (See Figure 12) Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Notes: ** When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. I SD ≤ -21A, di/dt ≤ -480A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C Pulse width ≤ 300µs; duty cycle ≤ 2%.
Uses IRF5210 data and test conditions Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Conditions V(BR)DSS Drain-to-Source Breakdown Voltage -100 ––– ––– V VGS = 0V, ID = -250µA ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– -0.11 ––– V/°C Reference to 25°C, ID = -1mA RDS(on) Static Drain-to-Source On-Resistance ––– ––– 0.06 Ω VGS = -10V, ID = -24A VGS(th) Gate Threshold Voltage -2.0 ––– -4.0 V VDS = VGS, ID = -250µA gfs Forward Transconductance 10 ––– ––– S VDS = -50V, ID = -21A ––– ––– -25 µA VDS = -100V, VGS = 0V ––– ––– -250 VDS = -80V, VGS = 0V, TJ = 150°C Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V Gate-to-Source Reverse Leakage ––– ––– -100 nA VGS = -20V Qg Total Gate Charge ––– ––– 180 ID = -21A Qgs Gate-to-Source Charge ––– ––– 25 nC VDS = -80V Qgd Gate-to-Drain ("Miller") Charge ––– ––– 97 VGS = -10V, See Fig. 6 and 13
td(on) Turn-On Delay Time ––– 17 ––– VDD = -50V tr Rise Time ––– 86 ––– ID = -21A td(off) Turn-Off Delay Time ––– 79 ––– RG = 2.5Ω tf Fall Time ––– 81 ––– RD = 2.4Ω, See Fig. 10 Between lead, ––– ––– and center of die contact Ciss Input Capacitance ––– 2700 ––– VGS = 0V Coss Output Capacitance ––– 790 ––– pF VDS = -25V Crss Reverse Transfer Capacitance ––– 450 ––– ƒ = 1.0MHz, See Fig. 5 Electrical Characteristics @ TJ = 25°C (unless otherwise specified) IGSS ns IDSS Drain-to-Source Leakage Current nH 7.5 LS Internal Source Inductance Parameter Min. Typ. Max. Units Conditions IS Continuous Source Current MOSFET symbol (Body Diode) ––– ––– showing the ISM Pulsed Source Current integral reverse (Body Diode) ––– ––– p-n junction diode. VSD Diode Forward Voltage ––– ––– -1.6 V TJ = 25°C, IS = -24A, VGS = 0V trr Reverse Recovery Time ––– 170 260 ns TJ = 25°C, IF = -21A Qrr Reverse Recovery Charge ––– 1.2 1.8 µC di/dt = -100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) A S D G -40 -140 |
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