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SMP18 Fiches technique(PDF) 3 Page - Analog Devices

No de pièce SMP18
Description  Octal Sample-and-Hold with Multiplexed Input
Download  8 Pages
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Site Internet  http://www.analog.com
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SMP18 Fiches technique(HTML) 3 Page - Analog Devices

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SMP18
REV. C
–3–
PIN CONNECTIONS
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
SMP18
CH4OUT
CH0OUT
CH1OUT
CH2OUT
VDD
CH6OUT
INPUT
CH7OUT
B CONTROL
A CONTROL
CH3OUT
CH5OUT
INH
VSS
DGND
C CONTROL
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option
SMP18FP
–40
°C to +85°C
Plastic DIP
N-16
SMP18FRU
–40
°C to +85°C
TSSOP-16
RU-16
SMP18FS
–40
°C to +85°C
SO-16
R-16A
ABSOLUTE MAXIMUM RATINGS
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .
±20 mA
(Not short-circuit protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA*
JC
Units
16-Pin Plastic DIP (P)
76
33
°C/W
16-Pin SOIC (S)
92
27
°C/W
16-Lead TSSOP (RU)
180
35
°C/W
NOTES
*
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for plastic DIP packages;
θ
JA is specified for device soldered to printed
circuit board for SOIC and TSSOP packages.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP18 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.


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