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ADV7403 Fiches technique(PDF) 9 Page - Analog Devices |
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ADV7403 Fiches technique(HTML) 9 Page - Analog Devices |
9 / 20 page Data Sheet ADV7403 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating AVDD to AGND 4 V DVDD to DGND 2.2 V PVDD to AGND 2.2 V DVDDIO to DGND 4 V DVDDIO to AVDD −0.3 V to +0.3 V PVDD to DVDD −0.3 V to +0.3 V DVDDIO to PVDD −0.3 V to +2 V DVDDIO to DVDD −0.3 V to +2 V AVDD to PVDD −0.3 V to +2 V AVDD to DVDD −0.3 V to +2 V Digital Inputs Voltage to DGND DGND − 0.3 V to DVDDIO+ 0.3 V Digital Outputs Voltage to DGND DGND − 0.3 V to DVDDIO+ 0.3 V Analog Inputs to AGND AGND − 0.3 V to AVDD + 0.3 V Maximum Junction Temperature (TJ MAX) 125°C Storage Temperature Range −65°C to +150°C Infrared Reflow Soldering (20 sec) 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL PERFORMANCE To reduce power consumption when using the device, the user is advised to turn off any unused ADCs. Keep the junction temperature less than the maximum junction temperature (TJ MAX) of 125°C. The junction temperature is calculated by TJ = TA MAX + (θJA × WMAX) where: TA MAX = 85°C. θJA = 30°C/W. WMAX = ((AVDD × IAVDD)+(DVDD × IDVDD)+ (DVDDIO × IDVDDIO) + (PVDD × IPVDD)). THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Package Type θJA1 θJC2 Unit 100-Lead LQFP 30 7 °C/W 1 It is a 4-layer printed circuit board (PCB) with a solid ground plane (still air). 2 It is a 4-layer PCB with a solid ground plane. ESD CAUTION Rev. B | Page 9 of 20 |
Numéro de pièce similaire - ADV7403_15 |
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Description similaire - ADV7403_15 |
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