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AD9060 Fiches technique(PDF) 4 Page - Analog Devices

No de pièce AD9060
Description  10-Bit 75 MSPS A/D Converter
Download  12 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9060 Fiches technique(HTML) 4 Page - Analog Devices

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REV. B
AD9060
–4–
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Options
AD9060JZ
0
°C to 70°C
Leaded Chip Carrier
Z-68D
AD9060KZ
0
°C to 70°C
Leaded Chip Carrier
Z-68D
AD9060/PCB
0
°C to 70°C
Evaluation Board
ABSOLUTE MAXIMUM RATINGS
1
+VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6 V
–VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–6 V
AIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +2 V
+VREF, –VREF, 3/4REF, 1/2REF, 1/4REF
. . . . . . . . . –2 V to +2 V
+VREF to –VREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V
ENCODE,
ENCODE . . . . . . . . . . . . . . . . . . . . . . . 0 V to –V
S
3/4REF, 1/2REF, 1/4REF Current . . . . . . . . . . . . . . . . . . . ± 10 mA
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature
AD9060JZ/AD9060KZ . . . . . . . . . . . . . . . . . . . . 0
°C to 70°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Maximum Junction Temperature
2 . . . . . . . . . . . . . . . . . 150°C
Lead Soldering Temp (10 sec) . . . . . . . . . . . . . . . . . . . . 300
°C
NOTES
1 Absolute maximum ratings are limiting values to be applied individually and
beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
2 Typical thermal impedances (part soldered onto board): 68 -lead ceramic chip
carrier:
θJC = 1°C/W; θJA = 17°C/W (no air flow); θJA = 15°C/W (air flow =
500 LFM).
EXPLANATION OF TEST LEVELS
Test Level
I.
100% production tested.
II.
100% production tested at 25
°C and sample tested at
specified temperatures.
III. Sample tested only.
IV.
Parameter is guaranteed by design and characterization
testing.
V.
Parameter is a typical value only.
VI.
All devices are 100% production tested at 25
°C. 100%
production tested at temperature extremes for extended
temperature devices; sample tested at temperature extremes
for commercial/industrial devices.
MECHANICAL INFORMATION (DIE LAYOUT)
Die Dimensions . . . . . . . . . 206 mils
× 140 mils × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 4 mils
× 4 mils
Metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
DIE LAYOUT
GND
D4
D3
D2
D1
(LSB) D0
GND
GND
–VS
+VS
ENCODE
ENCODE
+VREF
+VSENSE
GND
D5
D6
D7
D8
D9
OVERFLOW
GND
GND
–VS
NC
–VREF
–VSENSE
LSB INVERT
NC = NO CONNECT
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9060 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.


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